SR ENGINEER, ADVANCED PROCESS DEVELOPMENT

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Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job Description

Hybrid Bond Assembly Process Development Engineer

The successful candidate will be responsible for development, optimization, qualification, and technology transfer of advanced packaging assembly processes, with primary focus onhybrid bonding / advanced die stacking technologies for HBM and next-generation products. Assembly process development, hybrid-bond paths, C2W activities, qualification, and transfer work.

• Develop, optimize, and characterizehybrid bonding and advanced stacking assembly processes for next-generation HBM products.

• Own process development fromconcept/feasibility through qualification and manufacturing transfer.
• Drive process-window development, DOE, characterization, optimization, and robustness improvement.
• SupportC2W / advanced die-stacking integration, including bonding-related upstream and downstream process interactions. Internal work specifically references C2W hybrid-bond activities.
• Develop and maintain process specifications, control plans, qualification criteria, and manufacturing documentation.
• Leadequipment evaluation, process/tool qualification, and capability improvement, working with equipment suppliers and internal equipment teams.
• Execute structuredroot-cause analysis and problem solving for yield, quality, reliability, defect, and process integration issues.
• Applyrisk-analysis methodologies such as pFMEA during NPI and process qualification. Current HBM4/HBM4E work includes explicit pFMEA alignment activities.
• Analyze experimental and manufacturing data using statistical methods to identify key process parameters, interactions, and improvement opportunities.
• Collaborate closely withprocess integration, equipment, product, quality, manufacturing, materials, and supplier teams to deliver technology milestones.
• SupportNPI readiness and cross-site technology transfer, including process-condition alignment, training, documentation, and manufacturing ramp readiness. Internal HBM4E work includes process-condition alignment and SG transfer/training activity.
• Drive continuous improvement inyield, quality, cost, cycle time, process capability, and equipment productivity.
• Participate in technical reviews and clearly communicate development status, risks, data, conclusions, and recommendations to cross-functional stakeholders.
• Familiarity with efficiency problem solving such as KT analysis, Five Whys Technique, 8D Problem Solving.
• Using AI on daily work.

Required Skills:

• Bachelor's or Master's degree inMaterials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Semiconductor Engineering, Physics, or related discipline.
• Strong understanding ofsemiconductor assembly, wafer-level packaging, or advanced packaging processes.
• Hands-on experience inprocess development, process integration, equipment engineering, or manufacturing engineering.
• Strong knowledge ofDOE, SPC, process capability, statistical analysis, FMEA/pFMEA, and structured problem-solving methodologies.
• Ability to perform systematicdata analysis, failure analysis, root-cause identification, and process optimization.
• Understanding of semiconductorNPI, process qualification, change control, and technology-transfer methodology.
• Ability to establish process windows and translate development learning into manufacturable process controls.

• Hybrid Bond / Advanced Packaging Knowledge Preferred

  I would make thesepreferred rather than mandatory, otherwise the candidate pool may become unnecessarily narrow:
  • Experience withhybrid bonding, direct bonding, Cu-Cu bonding, C2W, W2W, or high-accuracy die stacking.
  • Understanding of hybrid-bonding critical factors such as: Surface preparation and cleanliness Particle/contamination control Bond interface quality Alignment accuracy Wafer/die warpage Bonding temperature/pressure/process window Post-bond inspection and defect analysis
  • Knowledge of upstream/downstream advanced assembly processes such aswafer preparation, cleaning, dicing, die handling, bonding, encapsulation, thinning, and metrology.
  • Experience with advanced packaging / HBM manufacturing environments.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact athrsupport_taiwan@micron.com.

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