MD
Senior Principal Engineer (Board & System Hardware Design – AI & Cloud Infrastructure)
Macpower Digital Assets Edge Private Limited
🇺🇸 United States
On-site
Staff / Principal
5 days ago
$200,000 – $266,400 / year
- AI
- Fabric
- System Design
- Shopify Liquid
- PCIe
5 days ago
- As Senior Principal Engineer (Board & System Hardware Design – AI & Cloud Infrastructure), you will be the senior technical authority guiding customer hardware design-in on the Ethernet Switch and UALink platforms, and a key technical bridge between the silicon teams, internal hardware engineering, and the field. Your primary mission is to ensure that customers' next-generation switches, AI fabric platforms, and networking systems are designed right the first time — performant, manufacturable, reliable, and ready for high-volume production.
- This is a deep individual contributor role with a strong system-design and productization focus. You will spend most of your time reviewing and shaping customer hardware designs — covering board architecture, PCB stack-up and material selection, power architecture, thermal design, mechanical integration, and reliability and retain full hands-on capability across the entire design lifecycle from architecture through schematic, layout guidance, and bring-up. You will also play a central role in defining and supporting reference designs for new silicon and serving as a trusted technical educator to both customers and internal teams. You will be a key technical voice in the evolution toward 224G and 448G SerDes-class systems and the emerging open AI fabric standards.
- Serve as the senior technical advisor to customer hardware teams designing platforms around the Ethernet switches and UALink silicon, from early architecture through production ramp.
- Lead design-in reviews of customer schematics, PCB stack-ups, and overall system architectures, identifying risks early and guiding customers to best-in-class implementations.
- Define, develop, and support reference designs for new silicon — partnering with silicon, packaging, and internal HW engineering teams from early product definition through customer release.
- Work closely with internal hardware engineering and silicon teams as a feedback channel from the field — influencing silicon I/O, package, power, and reference design choices based on real customer deployment learnings.
- Drive PCB stack-up strategy and material selection (low-loss laminates, copper roughness, glass weave, via construction) to meet high-speed performance and cost targets.
- Own architecture, schematic, layout guidance, and bring-up of reference and evaluation platforms, applying full lifecycle hands-on expertise where needed.
- Guide customers on power delivery architecture, including PDN design, multi-rail sequencing, decoupling strategy, and tolerance analysis for high-current ASICs.
- Advise on thermal design, mechanical integration, and cooling strategies (air, liquid, immersion) to meet performance and reliability targets in real deployments.
- Provide guidance on signal and power integrity, reviewing customer SI/PI simulations and contributing simulations directly when the project requires it.
- Drive design for reliability, manufacturability, and testability — ensuring smooth transitions to production at ODM/CM partners.
- Develop and deliver technical training to customers and internal teams covering core silicon, reference designs, high-speed design best practices, and productization methodologies.
- Provide technical leadership on 112G and 224G PAM4 SerDes designs today, and help shape the hardware approach for next-generation 448G systems.
- Lead hardware bring-up support, root-cause debug, and issue resolution during customer lab phases and early production.
- Partner closely with Silicon Design, Packaging, SI/PI, Software, and Operations teams to deliver fully integrated solutions.
- Contribute to product definition and roadmap planning by bringing real-world customer feedback into architecture and marketing discussions.
- Represent the organization's hardware expertise in customer briefings, executive reviews, and industry technical forums.
- PhD, Master's, or Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field.
- 15+ years of experience in hardware design, development, and validation of high-speed networking or compute systems.
- 7+ years of dedicated experience in board and system design for high-speed platforms involving modern SerDes (25G NRZ through 112G/224G PAM4).
- Proven full-lifecycle ownership of complex high-speed boards: architecture, schematic, layout guidance, and bring-up.
- Demonstrated experience defining and delivering reference designs that enabled customer or internal platform adoption.
- Strong expertise in PCB stack-up design and material selection for high-speed, high-layer-count boards.
- Deep experience with power architecture for high-current ASICs, including PDN design, sequencing, decoupling, and tolerance analysis.
- Solid background in thermal design and mechanical integration for high-power network and AI systems.
- Working knowledge of SI/PI principles, with the ability to review customer simulations and run targeted simulations independently when needed.
- Hands-on experience with hardware bring-up, lab debug, and root-cause analysis using industry-standard lab equipment.
- Deep understanding of high-speed interfaces: Ethernet, PCIe, DDR, advanced SerDes, and modern power delivery architectures.
- Strong grasp of design for reliability, manufacturability, and testability across the product lifecycle.
- Customer-facing experience supporting complex technical engagements and resolving real-world deployment issues.
- Proven ability to develop and deliver technical training content to engineering audiences.
- Excellent communication skills, with the ability to influence senior customer engineering teams and collaborate across disciplines and geographies.
- Direct experience with Ethernet switch platforms (any tier) and/or emerging open AI fabric standards and architectures.
- Experience designing or reviewing platforms targeting megascale data center deployments.
- Background in reference platform design and customer enablement for silicon-based solutions.
- Familiarity with ODM/CM manufacturing flows, including DFM/DFT, qualification, and reliability testing.
- Experience with advanced cooling approaches (liquid, immersion) for high-power AI/networking platforms.
- EDA tool fluency in either Cadence (Allegro/Sigrity) or Mentor/Siemens (Xpedition/HyperLynx) ecosystems — tool-agnostic candidates with deep expertise welcome.
- Track record of influencing silicon and platform roadmaps based on customer and field insights.
- Set the technical bar for board and system hardware design quality across the most strategic customer engagements.
- Serve as a key technical interface between customers, silicon teams, and internal hardware engineering — accelerating learning in both directions.
- Mentor engineers across the team and lead training for customers and internal stakeholders, raising collective expertise in system design, productization, and customer enablement.
- Shape the direction of customer-facing hardware solutions and influence next-generation product evolution.
- Act as a technical ambassador, representing the hardware capabilities to top-tier customers and partners.
- Travel as needed to customer sites, ODMs, and labs — typically project-driven rather than continuous.
Senior Principal Engineer (Board & System Hardware Design – AI & Cloud Infrastructure) · Macpower Digital Assets Edge Private Limited