
ãTakasaki/ToyosuãPrinciple Package Engineer
- ANSYS
- IoT
Not enough detail in this posting to match
1. Package Development & NPI Support
 - Support package development activities for new Power MOSFET products including:
   TOLL / TOLG / TOLT
   Bottom-side cooled (BSC)
   Dual-side cooled (DSC)
   Top-side cooled (TSC)
  . Advanced lead frame and clip-bond packages
 - Define package requirements and specifications for new product development.
 - Support package qualification and AEC-Q101 compliance activities.
 - Drive package-related activities during NPI and product transition.
2. Thermal & Mechanical Engineering
 - Perform thermal analysis and package characterization.
 - Conduct thermal resistance and thermal impedance measurements.
 - Evaluate package reliability associated with:
   Power cycling
   Thermal cycling
   Solder joint reliability
   Mechanical stress
 - Support package-level failure analysis and root cause investigation.
3. Package Benchmarking & Technology Survey
 - Benchmark competitor power package technologies.
 - Analyze package construction, materials, and performance.
 - Identify technology trends and recommend future package roadmaps.
 - Conduct package reverse engineering and technical assessments.
4. Simulation & Modeling
 - Develop and maintain thermal simulation models.
 - Support electrical and mechanical package simulations.
 - Correlate simulation results with measurement data.
 - Collaborate with system engineers on thermal optimization and system-level performance evaluation.
5. Product & Customer Support
 - Support customer inquiries regarding:
   Thermal performance
   Package selection
   Reliability considerations
 - Work with Application Engineering teams on customer design support.
 - Develop package-related technical documentation and application notes.
6. Cross-Functional Collaboration
 - Coordinate package activities with:
   Design Engineering
   Product Engineering
   Reliability Engineering
   Manufacturing
   Marketing
   External package suppliers
 - Participate in product definition reviews and technical decision-making.
ãMUSTã
Thermal characterization and analysis
Semiconductor package design fundamentals
Reliability testing and qualification.
Failure analysis techniques.
Statistical data analysis.
PCB and thermal design knowledge.
ãWANTã
Thermal simulation tools:
 ANSYS Icepak
 ANSYS Mechanical
 FloTHERM
Familiarity with:
 Automotive semiconductor requirements
 AEC-Q101
 APQP/PPAP
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ãTakasaki/ToyosuãPrinciple Package Engineer · Renesas Electronics