(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d)
Q Ant Gmbh
🇩🇪 Germany
On-site
Senior
4 months ago
- AI
- Integration Testing
- Foundry
- ANSYS
- Python
4 months ago
You will drive the design, development, and optimisation of advanced PIC components - with a particular focus on state-of-the-art fiber-to-chip coupling and photonic packaging - driving solutions from initial concept through layout, fabrication, and production-ready integration.
As a technical lead for specific PIC components, you will drive innovation across the full photonic integration lifecycle, define design methodologies, and coordinate cross-functional teams from concept to production. Your expertise in fiber-to-chip coupling and packaging will directly distinguish Q.ANT’s photonic solutions and shape the company’s technology roadmap.
Location: Stuttgart, Germany
Type: Permanent employment, full-time
Work mode: Onsite with max. 1 day remote work per week
What You Will Do
- Drive the development of state-of-the-art fiber-to-chip coupling solutions for industry environments - driving mode matching, loss budget optimisation, and packaging integration from component design through production-ready delivery•   Lead the design, prototyping, and validation of specific photonic chip components - from concept through layout, tape-out coordination, fabrication, and packaging - ensuring all deliverables meet performance specifications and schedule targets
- Implement photonic computing architectures on chip; drive innovation and new technology development in the PIC domain, proposing novel components and integration strategies that feed directly into Q.ANT’s product and technology roadmap
- Coordinate cross-disciplinary engineering projects (design, development, integration, testing) from concept to production - working closely with packaging, test, and foundry teams; collect and consolidate specifications from stakeholders and translate them into circuit definitions
- Mentor junior engineers and technicians; provide technical guidance and ensure effective collaboration across all project phases
- Present complex technical findings and design decisions to both technical peers and executive-level stakeholders with clarity and precision
- Strong academic foundation in Photonics, Electrical Engineering, Applied Physics, or a related field (Master’s degree or PhD); equivalent industry experience considered
- 3+ years of proven hands-on experience in photonic design, layout, and tape-out coordination
- In-depth expertise in fiber-to-chip coupling interfaces, including mode matching, packaging constraints, and loss budget management
- Advanced proficiency in photonic simulation tools (e.g., Lumerical/Ansys, RSoft, Photon Design Suite, or equivalent) with demonstrated ability to produce design-ready simulation outputs
- Solid practical experience with a PIC-specific layout tool (e.g., Nazca, GDSFactory, or Luceda) and advanced Python skills applied to photonic design workflows - automation, simulation scripting, and data analysis
- Solid grounding in optical device characterization techniques and interpretation of optical/electrical test data
- Proven ability to coordinate cross-functional technical investigations across teams without formal authority and strong communication skills at both technical and executive level
- Proven track record collecting and consolidating specifications from stakeholders and translating them into circuit definitions
- Fluent English; German is beneficial - working language in the team is English
None of the following are required - they are genuine bonuses and we do not expect any one candidate to bring all of them:
- First experimental experience with TFLN / LNOI
- Understanding of AI or high-speed optical communication system requirements for PICs
- Knowledge of mixed-signal and photonic/electronic co-packaging challenges
- Experience with foundry collaboration and process transfer to external manufacturing partners
- Make impact at scale: Your verification and integration work directly determines which PIC technologies are production-ready - high stakes, high impact from day one
- Work on the leading edge: Photonic integrated circuit technologies that are shaping the next decade of computing
- Own your work from day one: Shape characterization strategies, integration workflows, and roadmap inputs on your own, with direct impact on product success
- Fast-track your growth: Work on challenges with few industry precedents - every problem you solve becomes new institutional knowledge and potentially industry-defining IP
- World-class team: Collaborate alongside a passionate, international, cross-functional team of experts in photonics, electronics, and packaging
- Direct access to leadership: Work closely with the company’s founders, including CEO Dr. Michael Förtsch, and the Q.ANT senior leadership team
- Collaborative culture: Innovative work environment that values technical excellence, open communication, and pragmatic problem-solving
- Be part of history: Join at the inflection point where photonic computing transitions from research to mainstream - your contributions will shape this transformation
We are looking for a hands-on senior engineer who gets energized by designing and delivering advanced PIC components, pioneering fiber-to-chip coupling solutions, and directly shaping next-generation photonic technology.
Ready to push the boundaries of what photonic integrated circuits can do?
We are looking forward to receiving your application!
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Q.ANT is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.
(Senior) PIC Design Engineer - Architecture & Fiber Coupling (f/m/d) · Q Ant Gmbh