Product Engineering Architect – High-Speed IP PHY

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

Position Overview

Join a growing and dynamic IP team developing best-in-class digital and mixed-signal IP solutions. This role focuses on post-sales technical support for high-performance interface IP, working as part of a team supporting UCIe, PCIe, USB, DPHY, Ethernet, DDR, LPDDR, GDDR, and HBM PHYs.

The Product Engineering Architect is a primary technical team leader and product owner, responsible for driving product engineering activities across the full lifecycle—from pre-sales engagement and pre-silicon integration to post-silicon bring-up and customer deployment. This role serves as a primary interface between customers and Cadence R&D, leading technical discussions, resolving complex issues, and ensuring successful product adoption. Additionally, this role will serve as the primary focal point of contact for internal and external teams engaging with the local product engineering team. The Architect will engage in both technical customer discussions and local team management and leadership as part of the worldwide product engineering organization.

This position requires strong technical depth, customer-facing leadership, excellent communication skills, and the ability to drive execution across global, cross-functional teams.Team management and coordination of local team resources are also required, as is the ability to work collectively in the product engineering organization to maintain appropriate status and prioritization information pertaining to ongoing customer support activities.

Key Responsibilities

• Act as the primary product engineering owner for high-speed interface IPs (PCIe, UCIE, Ethernet, USB, DDR, LPDDR, GDDR, HBM) at the customer level
• Lead customer engagements, drive technical discussions, design reviews, and deployment strategy
• Own and drive resolution of complex subsystem integration and implementation issues
• Lead SoC integration reviews covering PHY and controller subsystems
• Provide technical leadership for RTL, gate-level simulations, and timing closure strategies
• Define and drive improvements to integration methodologies, checklists, and customer collateral
• Lead post-silicon bring-up and debug activities, ensuring successful customer deployment
• Collaborate cross-functionally with R&D, validation, and applications teams to deliver product readiness
• Drive continuous improvement in customer experience, turnaround time, and engineering quality
• Mentor and lead all team members and provide technical guidance across projects as needed
• Work with global product engineering management to define, develop, and consistently execute best-in-class customer support procedures
• Leverage AI tools to improve debug efficiency, data analysis, and decision-making

Position Requirements

• Strong experience with high-speed interface IP
• Deep understanding of RTL design, gate-level verification, and simulation methodologies
• Experience with synthesis, STA, and timing closure; backend knowledge is a plus
• Familiarity with DFT methodologies, test flows, and system validation approaches

Skills & Qualifications

[Required]

• Bachelor’s in electrical engineering, Computer Engineering, or related field with 15+ years, Master’s with 12+ years, or PhD with 10+ years of relevant experience
• Proven ability to solve complex technical problems and drive root cause to closure
• Experience leading cross-functional technical efforts across design, validation, and customer teams
• Strong communication skills with ability to influence customer and internal stakeholders
• Experience managing multiple priorities, escalations, and technical reviews
• Demonstrated ability to represent the organization in customer-facing technical roles
• Strong ownership mindset and ability to drive deliverables independently
• Demonstrated ability to communicate and coordinate well with direct reports in local team and supervising management within a larger organization

[Preferred]

• Experience with memory and/or high-speed communication interfaces (DDR, LPDDR, PCIe, Ethernet, UCIe, USB)
• Understanding of analog/mixed-signal design practices
• Experience in customer-facing silicon debug and bring-up environments
• Familiarity with AI-assisted workflows and data-driven debug techniques

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