Principal Process Engineer

Position Summary

The Principal Process Engineer serves as the highest technical authority for Circuit Card Assembly (CCA) manufacturing within the Center of Excellence. This role provides expert-level leadership in advanced process development, cross-functional project execution, and technology advancement for high-reliability defense and aerospace electronics. The Principal Engineer drives major initiatives that improve quality, yield, reliability, and cost performance, while ensuring strict compliance with IPC, J-STD, and MIL standards. The ideal candidate possesses deep subject-matter expertise, a strong record of leading complex technical projects, and the ability to influence engineering direction across the facility.

Key Responsibilities

• Lead development, implementation, and optimization of advanced CCA manufacturing processes including SMT, wave/selective soldering, bonding/staking, conformal coating, and ruggedization.
• Establish long-range process capability goals and define technical strategies to enhance manufacturing robustness, automation, and efficiency.
• Serve as the technical authority for processing documentation, work instructions, and standards for all CCA processes at the Center of Excellence.
• Maintain expert-level knowledge of IPC-A-610, J-STD-001, and MIL requirements and ensure all CCA processes meet these specifications.
• Lead major root cause investigations for complex or high-impact quality challenges and coordinate cross-functional corrective actions.
• Oversee advanced SPC, data analytics, and process monitoring for critical manufacturing steps.
• Lead multidisciplinary technical projects aimed at improving yield, manufacturability, cost, automation, and defect reduction.
• Partner closely with Design Engineering, Quality, Operations, and Program Management to resolve complex manufacturing challenges and support New Product Introduction (NPI).
• Act as the primary technical lead for implementation of new equipment, inspection systems, and automation technologies.
• Evaluate and integrate emerging manufacturing technologies such as SMT platforms, AOI/SPI systems, and automation solutions.
• Drive digital manufacturing enhancements, process modeling, and capability studies.
• Provide technical mentorship to Senior, Mid-level, and Junior Process Engineers.
• Review and approve major process changes, validation plans, and engineering documentation.
• Deliver training on advanced electronics manufacturing processes, inspection methods, soldering best practices, and thermal profiling.
• Develop and maintain advanced process metrics using data-driven approaches.
• Partner with Operations and Manufacturing Engineering to enhance MES/ERP capabilities supporting process control and traceability.

Required Qualifications

• Bachelor's degree in Mechanical, Electrical, Manufacturing Engineering, or related field; Master's degree preferred.
• 10+ years of experience in electronics manufacturing and CCA process engineering.
• Deep expertise in SMT, soldering, inspection technologies, and high-reliability electronics manufacturing.
• Strong knowledge of IPC-A-610, J-STD-001, and aerospace/defense manufacturing requirements.
• Proven experience leading multidisciplinary engineering projects and driving high-impact technical initiatives.
• Hands-on experience with SMT platforms (e.g., FUJI), AOI/SPI systems (e.g., Koh Young), wash processes, conformal coating, and ruggedization.
• Advanced capability in SPC, data analysis, Six Sigma methodologies, and process validation.
• Strong collaboration skills with ability to influence engineering and manufacturing decisions across teams.

Preferred Skills

• Experience supporting New Product Introduction (NPI) and establishing new manufacturing capabilities.
• Expertise with CAD tools for process/fixture design and manufacturing simulation.
• Demonstrated success implementing advanced automation and digital manufacturing solutions.
• Ability to lead multiple technical projects simultaneously with minimal supervision.
• Strong communication skills for guiding teams and presenting complex technical information.
• Basic understanding of APQP (Advanced Product Quality Planning) principles.
• Working knowledge of DMAIC methodology (Define-Measure-Analyze-Improve-Control).
• Familiarity with PDCA (Plan-Do-Check-Act) continuous improvement cycle.

Security Clearance

• Must be eligible to obtain and maintain a U.S. Government security clearance.