Photolithography Equipment Engineer

Business Line Description:
NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our Customers.

Job Summary:

Photolithography Equipment Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous equipment experience with ASML Scanner PAS5500/400/700 Scanners is required. Experience with Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM/KLA SL3/Archers/UVs/ASET/HRPs, Onto IRIS is desirable.

Key Challenges:

• Identification and reduction of reoccuring machine faults
• Creation of hard down action plans driving to root cause
• Developing and improving tool maintenance procedures
• Training maintenance technicians
• Reducing overall cost of equipment and scrap
• Improving tool utilization and availability
• Participating in and/or leading cross-functional and lean activity teams
• Supporting process development activities
• Sourcing and releasing new equipment
• Training maintenance technicians
• Knowledge of Six-Sigma root cause problem solving, SPC, 8D, FMEAs

Cross functional aspects:

• Working closely with Photo process team to identify and reduce source of process variation and implementing zero defect process

Job Qualifications:

• Must have a BS or MS degree in engineering or a degree in relevant field of studies
• More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment