Memory Systems Architect, Terafab

What to Expect

We are building Terafab, a vertically integrated semiconductor factory at an unprecedented scale. The facility houses logic, memory, packaging, test, and lithography mask production under one roof, optimized for rapid iteration and maximum compute density per square foot. 

This role owns DRAM system architecture for those products. You will set the silicon, package, module, and host-interface choices that the design, product, and platform teams have to build. Near-term execution and the next memory generation are both yours. 

What You’ll Do

• Define and evolve DRAM system architectures for performance, capacity scaling, reliability (RAS), and observability 
• Make the trade-offs across DRAM silicon, packaging, modules, boards, and the system the memory sits in 
• Influence host memory-controller and platform architecture with the CPU, GPU, and SoC teams that consume the memory 
• Turn system RAS and telemetry needs into features that can actually be built 
• Evaluate emerging memory technologies and say what they do, and do not do, to the product roadmap 
• Work with internal teams and partners so architectural direction is clear before design is locked 
• Keep the architecture consistent across teams and mentor the engineers who have to implement it 
• Use AI tools in the day-to-day work. Spec review, trade-off analysis, and documentation should move faster because of them 

What You’ll Bring

• Degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent experience 
• 15+ years of experience in DRAM architecture, memory systems, or advanced semiconductor builds 
• Experience turning system or customer requirements into architectural or silicon-level decisions that ship 
• Experience working across silicon, packaging, systems, and platforms, not inside one of those boxes 
• Experience with AI, LLMs, or ML tools to get work done, not as a side experiment