•Responsible todevelop andqualify new LQFP &BGA packagesfortotal assemblyprocesses in automotive applications.•Responsible forquality,yield,cost andprocess improvementactivities.•Responsible forprocess documentation,process spec,standard work instruction,OCAP,QITetc.•Need to collaborate closely with cross functional team members to resolve conflicts and make fast decision to avoid any risk to the organization/company/customer.•Take ownership to work closely with upper management to align scope and direction of key projects.Requirements:•3-6 yearsof work experience withsemiconductor assembly backgroundfor automotive customers.•Experience inLQFP, MAPBGA,SiP,FCCSP,FCBGAetc. packing development will be an added advantage.•Good technical knowledge and hands-on experience in process characterization for key processes such aslaser dicing,plasma dicing,mechanical saw,die bond,wire bonding,mold,ball attach,marking,singulation etc.•Candidate must have great interpersonal skills, leadership skills, result orientated, self-driven and eager to strive for success.•Good SPC, Process Control and other relevant statistical & problem-solving skills•Good in Microsoft application (PowerPoint, Excel Macro, Word, etc.). Project Management knowledge is an added advantage.
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