IC Test Engineer

Job Description:
Key Responsibilities

• Test Development: Develop comprehensive test plans and procedures for integrated circuits (ICs), including defining testing methodologies and creating test programs. Write test automation code and adapt testing approaches to different device designs.
• Test Execution: Conduct functional testing and characterization of ICs using custom-built test stations and other measurement tools to evaluate performance, functionality, and reliability.
• Data Analysis: Analyze test results to identify trends, anomalies, and potential issues. Prepare detailed reports and provide recommendations based on the findings.
• Debugging: Investigate and troubleshoot test failures, collaborating with internal design and process engineering teams to identify root causes and implement solutions.
• Continuous Improvement: Identify and implement process improvements and best practices to enhance testing efficiency, accuracy, and effectiveness.
• Documentation: Maintain detailed documentation of test procedures, test results, troubleshooting activities, and corrective actions.

• Education: Bachelor's, Master's, or Ph.D. in Electrical Engineering or a closely related field, with thesis research and/or relevant industry experience in millimeter-wave (mm-wave) IC characterization.

• RF characterization of active and passive components, including reflection coefficient, impedance matching, third-order intercept point (TOI), 1 dB compression point (P1dB), noise figure, and related parameters.
• Proficiency in using RF test and measurement equipment, such as network analyzers, signal sources, and spectrum analyzers.
• Software development and programming proficiency in at least one of the following: C#, C++/.NET, C, or Microsoft Visual Studio.
• Wafer probe calibration and electrical measurements of integrated circuits.

• Experience automating electrical testing processes.
• Familiarity with industry standards and best practices for IC testing and characterization.
• Advanced programming skills in C#, .NET, and Microsoft Visual Studio.
• Knowledge of semiconductor device physics and manufacturing processes.

• Expertise in RF and analog integrated circuit design, characterization, and analysis.
• Knowledge of statistical analysis techniques and process improvement methodologies.
• Experience in printed circuit board (PCB) design.
• Experience with Client Advanced Design System (ADS) or equivalent engineering tools.

• Strong interpersonal, problem-solving, time-management, and communication skills, with the ability to collaborate effectively across multiple teams and projects in a dynamic environment.
• High motivation and a results-oriented approach to completing assigned tasks while meeting demanding product development schedules and maintaining world-class manufacturing standards.
• The ability to take ownership of responsibilities and provide technical leadership when required.

• Innovative Environment: Work with advanced technologies and contribute to the development and characterization of next-generation integrated circuits.
• Career Growth: Access opportunities for professional development, skill enhancement, and career advancement.
• Collaborative Culture: Join a supportive, collaborative team that values individual contributions and encourages knowledge sharing and teamwork.