
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
- AI
- Power BI
- SPC
- Python
- SQL
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Role Summary:
We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI isanticipated to become an integralcomponent of daily life. This proliferation is being fueled by advances in memory andcompute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsibleto deliver package development forhigh performance memory products and transfer to manufacturing.
We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team!
Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will alsobe required toidentify, diagnose, and proposeyield related breakthroughs. You will haveopportunity to work with peers and partners across organizations to coordinate the development and launch of new metrology and RDA technologies for solutions that drive the future.Additional responsibilities include establishing equipment evaluation and long-range strategy to enable advanced packaging technology roadmap.
Main Responsibilities:
Recipe Development and Optimization:
Develop andoptimize metrology recipes for various semiconductor processes
Ensure that the recipes areaccurate and efficient for production needs
Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)
Inspection and Characterization:
Establish inspection methodologies and best-known methods (BKM) for metrology processes
Perform in-line characterization and validation of metrology recipes
Data Analysis and Reporting:
Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress
Continuously analyze data toidentify improvement opportunities and ensure process efficiency
Quality and Performance Indicators:
Own and manage metrology tools, ensuring they meet performance indicators and quality standards
Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts
Collaboration and Coordination:
Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration ofnew technologies
Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes foroptimal performance and quality control
AI Responsibilities:
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment andcomplying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement byidentifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Candidate Profile
Minimum Required Qualifications:
PhD with≥2 yearsMaster’s degree with ≥5 years, orBachelor’s degree with ≥7years of relevant experience inElectrical Engineering, Materials Science, Chemical Engineering, Physics, ora related field.
Semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpagecontrol and packagingfield .
Must Have Technical Skills:
Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
Experience with Visual Basic for automation and tool integration.
Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
Hands on experience with wafer/assembly tools or metrology/RDA systems
Must Have Soft Skills:
Strong analytical and problem-solving capabilities.
Outstanding communication, leadership, and stakeholder management skills.
Ability to work independently and collaboratively in a fast-paced environment.
Ability to work cross-functionally with process, equipment, and reliability teams.
AI Requirements:
Ability to apply baseline digital fluency androle‑appropriate AI literacy to useAI‑enabled tools responsibly and effectively for research, analysis, content creation,problem‑solving, operational tasks, and achieving business outcomes.
Embody Micron’s core values:
People – Respect, develop, and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value
Speed –Act with purpose and set the pace
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contacthrsupport_sg@micron.com
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis · 1580 Micron Memory Taiwan Co.