Advanced Packaging Characterization & Diagnostics SME Engineer - Sr. Principal

Position Summary:

We are looking for a hardworking and passionate Advanced Packaging Development and Research Engineer for our Florida Advanced Packaging site.  The position requires significant experience in electronics packaging technology, wafer finishing (e.g. Si Interposer, C4 bumping), wafer level assembly (e.g. FanOut, Hybrid Bonding), substrate assembly, superconducting materials and quantum assembly.

In this role, you will be responsible to design and troubleshoot complex processes, create technical presentations, fabricate test systems and methodologies, tear down electronics packages and search out new technologies and ideas to deliver a qualified product to our foundry and internal clients.

Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Areas of Accountability: 

Support prototype build schedules and wafer deliverables that may utilize Si interposer, FanOut, and hybrid bonding manufacturing processes which will incorporate superconducting and non-superconducting materials.  Identify features and packages that require development and direct the team to deliver on schedule and with high yield a qualifiable final product.  Highlight any potential gaps in process flows and build external partnerships to enable fast turn prototyping.  When required, lead task forces to identify root causes, correct and maintain product deliverables.  

• Support integration engineers to characterize prototypes and new processes for our platform, technology services and research programs
• Understand and extract critical physical design information as needed to characterize packages.
• Utilize metrology tools, test tools and electrical analysis tools to characterize process conditions, identify root cause of any defects and document results.
• Coordinate failure analysis and interpret results across labs internal and external to support group
• Establish additional external engagements for analysis of packages
• Review, interpret and direct FEA needs
• Create training documents & write technical papers to teach state-of-the-art technologies within SkyWater and external.
• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to troubleshoot and identify issues and potential pitfalls for new products.
• Understand process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Utilize data analysis software to drive data driven decisions
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications:

Education: BS Engineering, MS/PhD preferred

Experience and Skills:

• 12+ years of Process Development & Integration Engineer in Advanced Packaging Fab environment of 10K and 1K clean rooms related to FanOut wafer level assembly, Quantum, Si Interposer and Hybrid Bonding.
• Advanced Packaging Fab processing tools knowledge/experience 
• MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Project Management skills and/or defined training a plus. 
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Can work both independently and in cross-functional teams for problem solving.

US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship. 

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