DMTS SiPh Packaging & Assembly Materials

About GlobalFoundries:

• GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visitwww.gf.com.    

Summary of Role: 

• This DMTS-grade positionwilldriveGF’sindustry leadingPhotonixplatformgrowthintoworld class fully packagedelectro-opticaltransceiver offeringsutilizing 2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on product and module reliability, package risk factors, packaging design rules, materials selection criteria, definition of electrical, photonic, and thermal stress plan forchiplet and product module reliability qualification. Competency indefinition of test and measurementmethodology for modules capable of over 6.4Tbps data transfer is a requirement. Validated record of photonic and electrical interconnect innovation and product release/partnership with optical/electrical OSAT ecosystem isrequired.  

• A successful candidate wouldpossess industry leading product definitionexpertise for photonic and electronic packages, with primary focus on the compatibility of photonic interconnect and packaging solutions with presentstate-of-the-art electrical interconnect solutions. It is expected that options for optical fiber attach will includedetachable fiber optic couplers,grating couplers, edge couplers,passive V-groove, and3D MEMs spot size converters which must be compatible with 3D electrical interconnect solutions including Copper RX, CopperuPillar, chip-on-wafer hybrid bonding and wafer-to-wafer hybrid bonding.   

EssentialResponsibilities:  

• Hands onGF technical subject matter expert forSiPhotonics packaging responsible to answer internal and external questions and to build GF capability in this area through shared knowledge training and recruitment efforts 

• Providesleadershipandtraining of engineers inproductpackaging designreviews, materials selection and FMEAs of customer packaging concepts 

• Protects clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP, meets industry expectations 

• Ensures that allnew technologies and features meet a standardized set of quality expectations tied to implementation intoapplication representativepackagesfor Data Centers, Automotive and Communications. 

• Driving GF leadership inglobalSiPhadvanced packagingproductinnovations, design enablement for customers,and efficientmanufacturing processes internally and with OSAT ecosystems.  

• Provides tools and complex analysis ofquality issues and associated financial implications  

• Protects the business by ensuring that all necessary requirements are met and thata technologyperforms to the expectations of a given customer or market to avoid costly re-designs 

• Ensures standardization of site-based quality processes are executed appropriately 

• Drives increased discipline and qualification robustness through a consistent global qualification process 

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Securityrequirements and programs  

Other Responsibilities:

Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications: 

• MS, or PhD + 20 or more years ofexperience 

• Expertise in photonic and electronic package architecture definition 

• Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing. 

• Experience in bringing packaged products from development into production fordata centers, automotive and communications  

• Expert in chip package interaction for 2D, 2.5D, 3DSiPh advanced packaging 

Preferred Qualifications:  

• A record of distinguished leadership on national and internationallevels such as contributing to national R&D agendas in science & technology, manufacturing. 

• Participation in industry standards boards 

• Materials science, thermal, mechanical, simulation background 

• Extensive experience with failure analysis, design of experiments, & packaging process integration 

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email atusaccommodations@gf.com and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address. 

An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations. 

GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory. 

All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law