Development Engineer – Adhesive Bonding Process Technology (f/m/x)

ZEISS Semiconductor Manufacturing Technology​

​Enabler for smaller, more powerful, and more energy-efficient microchips​

​Working for tomorrow today. ​

Around 80 percent of all microchips worldwide are produced using ZEISS technologies. As the centerpiece of every electronically controlled system, they have become an integral part of our everyday lives – whether in smartphones, smart homes or smart factories. ZEISS is a technology leader in the field of semiconductor manufacturing equipment. With high-precision lithography optics, photomask systems and process control solutions, ZEISS enables the production of ever smaller, increasingly powerful, and more energy-efficient microchips, and thus plays a pivotal role in the age of micro- and nanoelectronics.

Your Role

• Develop adhesive bonding processes and associated equipment for optomechanical assemblies and systems that form key elements of our latest optics for the semiconductor industry. This includes applying state-of-the-art adhesive applications and dispensing technologies to achieve highly precise and reliable bonded joints.

• Develop, validate, and qualify application processes and the required fixtures, then transfer them into production, including technical documentation and process capability analysis.

• Coordinate cross-functional collaboration with relevant specialist departments throughout the design, manufacturing, assembly, and commissioning of adhesive bonding fixtures, while ensuring achievement of performance, cost, and schedule targets.

• Align technical requirements with customers and suppliers during the development phase.

• Perform tolerance analysis and tolerance budgeting for processes, tooling, and manufacturing methods.

Your Profile

• A successfully completed university degree in mechanical engineering, mechatronics, manufacturing engineering, plastics engineering, or a comparable discipline.

• Ideally, knowledge of adhesive bonding processes, adhesive application technologies, adhesive dispensing, and/or adhesive material properties.

• Experience in the conceptual design and dimensioning of assembly stations and tooling, preferably for adhesive application processes.

• Knowledge of assembly and alignment processes for optomechanical components and related tolerance budgeting is an advantage.

• Strong teamwork and communication skills, combined with enthusiasm for close collaboration with production teams and cross-functional interfaces.

• A proactive, committed, and independent working style, together with an interest in working in a cleanroom environment.

• Good written and spoken German and English language skills.

Your ZEISS Recruiting Team: