Senior Process Engineer

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Own and support the Flip Chip Attach (FCA) process to achieve quality, yield, cost, reliability, and productivity targets.
• Provide technical support to Advanced Process Engineering in delivering process and equipment solutions that meet operational and development requirements.
• Monitor and maintain assembly yield and test yield performance related to the FCA process in alignment with departmental KPIs.
• Develop and set up new Flip Chip Attach processes, including recipe setup and optimization, process window studies, Design of Experiments (DOE), and Corner limit validations.
• Drive and establish Golden Recipe configurations for new package qualifications.
• Maintain and standardize FCA recipe templates in accordance with Positrol log guidelines.
• Execute process qualifications to meet Critical-to-Quality (CTQ) requirements, CPK targets, Throughput (UPH) goals, Yield/cost objectives, and Risk assessment standards.
• Lead the introduction of new products, devices, and package processes into production while ensuring effective process transfer and handover to manufacturing.
• Support qualification activities for new materials, tools, and technologies.
• Perform troubleshooting and drive continuous improvement using structured problem-solving methodologies such as 5M + 1E, 5 Whys, DMAIC, and 8D.
• Develop and lead SiP (System in Package) assembly and IC packaging material and process development programs to meet quality, reliability, cost, yield, productivity, and manufacturing requirements.
• Lead new package and SMT/Flip Chip/Underfill qualification programs.
• Plan and conduct experiments to fully characterize materials and processes throughout pathfinding, development, and ramp stages.
• Develop solutions to improve quality, reliability, cost, yield, process stability/capability, and productivity using statistical knowledge and problem-solving tools.
• Establish process control systems and support process transfer to high-volume manufacturing and new factory start-up activities.
• Maintain product quality while developing and introducing package cost reduction programs.
• Collaborate closely with Production, Quality, Equipment Engineering, Factory Automation, IT, NPI teams, and suppliers/vendors.
• Coordinate and lead continuous improvement projects within the FC team.
• Develop and maintain process documentation, including Standard Operating Procedures (SOPs) and Work Instructions (WIs).
• Carry out additional responsibilities and assignments as delegated by management.
• Lead 1-LOD initiatives including machine fingerprinting activity and driving prevention excursion management.

Required:

• Bachelor’s Degree or higher in Electrical Engineering, Mechanical Engineering, Physics, or related Engineering/Science disciplines.
• Minimum 8–10 years of experience in Flip Chip Attach process engineering, or 6 years for PhD holders.
• Experience in running thin die products for flip chip die-level assembly.
• Relevant engineering experience within the semiconductor industry is required.
• Strong hands-on experience with BESI Datacon, FUJI NXT, DEK NeoHorizon, and Kohyoung & PARMI SPI/AOI machines.
• Strong knowledge of semiconductor assembly processes and manufacturing operations.
• Strong machine programming, process troubleshooting, and production support capability.
• Strong analytical thinking and engineering problem-solving skills.
• Demonstrated capability in process optimization and quality improvement.
• Capable of leading a group of engineers to solve quality issues and improvement projects.

Preferred:

• Knowledge or experience in FMEA, SPC, 8D Problem Solving, Six Sigma, DOE, Minitab, and JMP.
• AI/ML experience related to manufacturing or process optimization is an added advantage.
• Experience in handling customer requirements, especially for automotive customers, is an added advantage.
• Proficiency in statistical data analysis and process simulation software.
• Demonstrated experience in pathfinding and developing new SMT/FCA/UF materials with vendors and qualification methodologies.
• Strong capability in failure analysis and root cause investigation using EDX, FTIR, Shadow Moire, simulation reports, and metrology data.
• Strong project management, planning, and organizational skills.
• Self-motivated, proactive, and capable of working independently with minimal supervision.
• Strong sense of urgency, accountability, and quality awareness.
• Excellent communication, teamwork, and interpersonal skills.
• Strong attention to detail and commitment to achieving goals.
• Ability to adapt and work effectively in a fast-paced manufacturing environment.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline or email compliance@sandisk.com.